Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chipsA new epitaxy system optimized for DRAM ...

Intel Corporation may benefit from tailwinds coming from advanced packaging technologies, which has led one firm to raise ...

Shares in JCET Group continued to surge after China's largest semiconductor packaging and testing provider said it plans to invest more than $1 billion to boost its advanced chip-packaging capacity.

The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies ...

SINGAPORE – Polymatech has opened a new advanced electronics manufacturing facility in Singapore that will serve as its Asia-Pacific hub for LED chip-on-board (CoB) packaging and advanced memory ...

US$1.15 billion investment underscores advanced packaging's role in boosting China's chipmaking capabilities amid rapid AI development Chinese chip-packaging and testing giant Jiangsu Changjiang ...

Jinman Han is President of Samsung Semiconductor, Inc. & leads the U.S. business, including Memory, Foundry, System LSI and LED. Almost every innovation introduced to the world has been touted as the ...

5.18.4. Packaging choices for packaging application processor environment (APE) in consumer electronics (1) 5.18.5. Packaging choices for packaging application processor environment (APE) in consumer ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...