EDN

Austriamicrosystems, IBM team for CMOS HV process

MUNICH, Germany — IBM and Austriamicrosystems have agreed to share a jointly developed high voltage CMOS manufacturing process. This will enable both companies as well as their foundry customers to ...
EDN

ST offers networking variant on ISDA 32-nm bulk CMOS

LONDON — European chip company STMicroelectronics NV (Geneva, Switzerland) has announced the availability of a bulk 32-nanometer CMOS manufacturing process and “platform” for the development of ASICs ...
Electronic Design

Philips Ramps 90-nm CMOS Products Into High-Volume

Philips ramped up three key 90-nm CMOS products into volume production at the Crolles2 Alliance wafer fab in Crolles, France. The products are baseband chips for highly integrated system-inapackage ...
Electronic Design

Alliance Produces Ultra-Dense SRAM Cell In 45nm CMOS Technology

The Crolles2 Alliance has described at the VLSI Symposium in Kyoto, Japan, the creation, under production conditions, of six-transistor SRAM-bit cells with an area less than 0.25 square microns—half ...
Tom's Hardware on MSN

IBM goes sub-1nm, develops 0.7nm-class technology

It uses two wafers instead of one, along with ultra-thin dielectric bonding ...