Electronics Weekly

LETI integrates III-V lasers on 200mm wafers using CMOS flow

Leti has integrated hybrid III-V silicon lasers on 200mm wafers using standard CMOS process flow. This shows the way to transitioning away from 100mm wafers and a process based on bulk III-V ...
EDN

Mixed-signal design flow enables RF CMOS chip

Spirea AB is a Swedish fabless semiconductor company developing highly integrated low-power, low-cost radio solutions for the Wireless LAN and PAN markets. This article describes how we assembled a ...
Design-Reuse

X-FAB Partners With Akustica to Deliver World's First CMOS MEMS Single-Chip Microphones

X-FAB to Provide Foundry Services for Akustica's Family of CMOS MEMS Silicon Microphone Chips ERFURT, GERMANY and PITTSBURGH, PA -- May 31, 2006 -- Akustica, Inc., a pioneer in acoustic system-on-chip ...
Electronic Design

IEDM sees transistor, memory, laser innovations

The International Electron Devices Meeting (IEDM) held Dec. 2-6, 2017, in San Francisco offered imec and Leti an opportunity to disclose several innovations. imec announced three new developments: ...
Electronic Design

Simplified High-k/Metal-Gate Process Increases Planar CMOS Speed

IMEC, the Belgium-based nanotechnology research center, announced at this week's VLSI Symposium that it has improved the performance of its planar CMOS using hafnium-based, high-k dielectrics and ...
EDN

Foundry offers bipolar CMOS DMOS process for power management market

Jazz Semiconductor, an independent wafer foundry focused primarily on specialty CMOS process technologies, today announced the availability of 0.5 micron BCD process technology targeted for power ...