A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the ...

For decades, semiconductor manufacturers have used chemical-mechanical polishing (CMP) as the primary technique for the smoothing and leveling (planarization) of dielectrics and metal layers. CMP ...

The semiconductor industry is constantly marching toward thinner films and complex geometries with smaller dimensions, as well as newer materials. The number of chemical mechanical planarization (CMP) ...

Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...

To allow real-time control of dielectric chemical mechanical planarization (CMP) processes to the 45 nm device node and beyond, Santa Clara, Calif.-based semiconductor manufacturing equipment leader ...

The technology of through-silicon via (TSV) is extensively employed for achieving dense 3D integration. TSV facilitates the electrical interconnection of various layers of integrated circuits in a ...

Qnity Electronics, Inc. ("Qnity") (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, ...

Suppliers of chemical mechanical planarization (CMP) slurries may be fierce competitors of Cabot Microelectronics, the company considered to be the sector's number one player, but they agree with the ...

Novellus Systems Inc. says it has taken what was good about SpeedFam-IPEC's technology and fixed what wasn't with Xceda. The Silicon Valley-based back-end-of-line process tool vendor today unveiled ...

Introduction strengthens STMicroelectronics’ position as a semiconductor technology leader Used by universities, research labs and companies for next generation System-on-Chip and allows CMP to ...