Understanding how dislocations (line defects in the crystal structure) occur when 3D-printing metals has been unclear to materials scientists. Understanding when and how dislocations form in ...

SiC is extensively used in microelectronic devices owing to its several unique properties. However, low yield and high cost of the SiC manufacturing process are the major challenges that must be ...

Two-dimensional (2D) materials have emerged as a significant class of materials promising for photocatalysis, and defect ...

TROY, NY—A promising semiconductor material could be improved if flaws previously thought irrelevant to performance are reduced, according to research published today in Nature Communications. A group ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...