With the significant reduction in package parasitics provided by the eGaN FET, the package inductance is minimized and is no longer the major parasitic loss contributor. The high frequency loop ...
Last evening, I attended a seminar given by Bruce Archambeault, an IBM distinguished engineer and overall EMC authority. His topic, “PCB Decoupling for Effective Power Integrity and EMI control” sheds ...
As on-board processing becomes more sophisticated integrating K-band RF, GSPS ADCs/DACs, and GHz-speed FPGAs on a single PCB, questions often arise about satellite grounding, particularly mixed-signal ...
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