Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at Imec; Harry Levinson, senior fellow and ...

Layout decomposition represents a critical step in the semiconductor manufacturing process, whereby integrated circuit designs are partitioned into multiple layers or masks to overcome the inherent ...

TOKYO--(BUSINESS WIRE)--Nikon Corporation has announced release of the NSR-S622D ArF immersion scanner to deliver world-class overlay and ultra-high productivity for the most demanding multiple ...

Si2 announced that Cadence has donated extensions to the OpenAccess community which enable physical design tools to represent Multi-Patterned Technology (MPT). Conventional photolithography cannot ...

Several fab tool vendors are rolling out the next wave of self-aligned patterning technologies amid the shift toward new devices at 10/7nm and beyond. Applied Materials, Lam Research and TEL are ...

2019 marked an important milestone for extreme ultraviolet (EUV) lithography. In that year, the EUV patterning technology was for the first time deployed for the mass production of logic chips of the ...

New dry resist technology being developed with ASML and imec will help to extend EUV lithography’s resolution, productivity and yield FREMONT, Calif., Feb. 26, 2020 (GLOBE NEWSWIRE) -- Lam Research ...

During a visit by President Barack Obama in February, Intel executives announced plans to build a new semiconductor facility in Chandler, Ariz. To cost more than $5 billion, the plant will be the most ...

TSMC's Japanese subsidiary, JASM, is set to begin mass production at its first wafer fab in Kumamoto in 2024. Save my User ID and Password Some subscribers prefer to save their log-in information so ...

Continued demand for mature- and mid-node production: Many analog, power, sensor and packaging layers continue to be manufactured using DUV (28–65 nm and larger), maintaining persistent equipment ...