Polar Instruments – a specialist in tools for pcb design, fabrication and test - has announced a free webinar on pcb layer stackup design using differential pairs. Presented by signal integrity guru, ...

PCB Signal integrity & Stackup design. Ever more complex PCB designs require layer stackups to be considered even before you layout the design. As a designer there are now vast choices of base ...

PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology with multi-layer redistribution layers (RDL).

What is software defined radio (SDR) and how does it benefit modern communications and RF applications? RF/microwave PCB design for Radar and SDRs. Challenges of SDR PCB design and ways to overcome ...

In these example schematics 16 RJ45 ports are used. For a different number of ports the schematics can easily be modified. These schematics are provided for reference only. For any designs based on ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...