DALLAS, July 16, 2024 /PRNewswire/ -- Texas Instruments (TXN) today introduced six new power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage ...

USI stated that the combination of low stray inductance, minimal on-resistance, and superior thermal performance delivers a significant boost in energy conversion efficiency and system reliability.

South Korea-based semiconductor company SEMIPOWER is developing next-generation power semiconductor module solutions centered on wide bandgap (WBG) materials including silicon carbide (SiC) and ...

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

The quest for ever-higher power densities has encouraged the rise of breathtaking levels of active/passive device integration and cool-running packaging technology. Advanced packaging technologies are ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

Wolfspeed has introduced two new 3.3 kV silicon carbide (SiC) power module families – including high-power half-bridge ...

Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV ‑ D3 mSiC ® Power Modules, designed to simplify and accelerate the adoption of solid-state transformers (SSTs) ...

Engineers at the Department of Energy’s Oak Ridge National Laboratory have developed a new ...

Richardson Electronics, Ltd. (NASDAQ: RELL) today announced a new global strategic partnership with NoMIS Power, a leading designer of advanced silicon carbide (SiC) power semiconductor technologies.

Microchip Technology has launched a new range of 3.3 kV silicon carbide (SiC) power modules to support SST designs.