“This PIC Packaging Center of Competency at C2MI, launched in collaboration with Aeponyx and our partners, helps turn advanced integrated photonics into repeatable, industrial-grade capabilities in ...

The investment transforms the Kentucky site from a finishing operation into a full end-to-end manufacturing facility.

On June 15, 2026, Circular Action Alliance (CAA) submitted its inaugural Program Plan to California’s Packaging Producer Responsibility ...

The Flexible Plastic Packaging Market is poised for sustained growth, driven by rising demand from the food & beverage, healthcare, personal care, and e-commerce sectors. Leading players are strengthe ...

Ulsan has eased eligibility requirements for its 2026 small business rent support program and began accepting applications ...

Anthropic is exploring Samsung's 2-nanometer process for a custom AI chip as AI developers seek lower costs and less ...

GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE™ wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) ...

Agency of Agriculture, Food & Markets This grant helps fund the purchase of equipment for dairy processing and packaging to ...

Jalapeño marks OpenAI’s move into custom chips, while Broadcom strengthens its role as AI’s infrastructure provider.

The Los Angeles Organizing Committee will begin accepting applications for 60,000 positions on its volunteer crew starting in July.

Federal agencies opened up an H-2A visa program to dairy farms facing seasonal labor shortages. The U.S. Department of ...

Digital Photonics upside from smart-glasses wins and AI data-center optical interconnects. See here for more details.